18
2026-06
Dear Customers and Partners, 445446 According to the General Office of the State Council's "Notice on the Arrangement of...
18
2026-06
Hardware engineers and procurement specialists handling BOM management will inevitably come across Bourns, a well-establ...
17
2026-06
Samsung is accelerating development of its Data Sharing Ecosystem Platform (DSEP) , aiming to operate a fully automated,...
16
2026-06
On June 16, onsemi announced that He Maojun has joined the company as China System Products VP and China GM , effective ...
15
2026-06
According to TrendForce, global top‑10 foundry revenue hit a record $47.95 billion in Q1 2026 , up 3.7% QoQ, driven by A...
12
2026-06
On June 12, South Korean semiconductor equipment maker Hanmi Semiconductor announced a ₩50 billion ($22.3M) investment i...
11
2026-06
SK Hynix has completed production validation for its 375‑layer 3D NAND and will convert existing lines at its Cheongju M...
10
2026-06
Nikon has announced a new digital lithography system for semiconductor backend processes, featuring 1.5μm resolution and...
09
2026-06
At Computex 2026, Cadence and Nvidia unveiled the ChipStack AI Super Agent – the industry’s first Level‑5 autonomous AI ...
08
2026-06
Diodes has expanded its AH371xQ series of automotive‑qualified Hall‑effect latches, designed for low‑magnetic‑threshold,...
06
2026-06
In industrial control, new energy systems, power conversion, and motor drive industries, Texas Instruments (TI) TMS320 s...
05
2026-06
At TSMC’s annual shareholders’ meeting, CEO C.C. Wei said the Nanjing fab faces no risk and that mature‑node competitive...
